RF passives and interconnect technology

For RF applications and interconnect technology we make examples like the ones below:

  • Micro-machined micro-wave cavity filters:
    – For frequencies above 20GHz
    – Unloaded Q-factors ~1000
    – Size ~1cm3
    – Realized with MEMS precision, avoiding the need for tuning
  • Submounts and interposers with 3D interconnects on:
    – Using 3D-lithography in combination with advanced patterning of metal on substrates
    – Also enabling 3D structures for inductors, transformers and balun
  • Metal-Insulator Transition (MIT) materials:
    – Offering attractive opportunities for power-limiting devices for RF front-end protection
    – Combining new Thin Film process technologies
    – Device architecture and microwave circuit design enable breakthrough results
    – E.g. for phased array radar systems

Check out our other MEMS applications

MEMS applications are many. Organ-on-a-chip for example, where a human organ is reproduced in its most elementary form: microelectromechanical systems device. Several applications stand out, because of their promise and our capabilities.

Relevant for you: MEMS & Micro Devices MEMS is our expertise

Sustainable competitive advantage through custom MEMS devices. Check out our services in the MEMS & Micro Devices key area of expertise.

Contact us about RF passives and interconnect technology

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