RF passives and interconnect technology

For RF applications and interconnect technology we make examples like the ones below:

  • Micro-machined micro-wave cavity filters:
    – For frequencies above 20GHz
    – Unloaded Q-factors ~1000
    – Size ~1cm3
    – Realized with MEMS precision, avoiding the need for tuning
  • Submounts and interposers with 3D interconnects on:
    – Using 3D-lithography in combination with advanced patterning of metal on substrates
    – Also enabling 3D structures for inductors, transformers and balun
  • Metal-Insulator Transition (MIT) materials:
    – Offering attractive opportunities for power-limiting devices for RF front-end protection
    – Combining new Thin Film process technologies
    – Device architecture and microwave circuit design enable breakthrough results
    – E.g. for phased array radar systems

Check out our other MEMS applications

MEMS applications are many. Organ-on-a-chip for example, where a human organ is reproduced in its most elementary form: microelectromechanical systems device. Several applications stand out, because of their promise and our capabilities.

Relevant for you: MEMS & Micro Devices MEMS is our expertise

Sustainable competitive advantage through custom MEMS devices. Check out our services in the MEMS & Micro Devices key area of expertise.

News & events

Projects on ultrasound innovation awarded for future generation microfabrication technologies for ultrasound products and imaging catheters.

Presentation by technologist René Sanders about microfluidic device standardization and manufacturability at the Polymer Replication on Nanoscale conf.

Increasingly complex ultra-high frequency IC chips demand state-of-the-art RF characterization, and Philips Engineering Solutions offers on wafer device characterization with powerful functionality.

Contact us about RF passives and interconnect technology

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