Increasingly complex ultra-high frequency IC chips demand state-of-the-art RF characterization, and Philips Engineering Solutions offers on wafer device characterization with powerful functionality.
A far more effective use of materials enables greater value creation. This approach revolves around innovation in materials and reuse of components and products.
This service allows companies to discover what Corporate Social Responsibility is all about and how to focus on activities which are successful in the long term and in the eyes of stakeholders.
Where: SuperNova Jaarbeurs Utrecht, The Netherlands.
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