We offer the following services:

  • Capability to process GaN-on-Si (dry etch, metallization) on 150 mm
  • Development and manufacturing of process flows for devices
  • Rapid electrical wafer characterization
  • Process development, manufacturing and characterization of test structures, and passive and active devices for high-voltage and RF-power applications
  • Wafer re-shaping, including re-beveling
  • Development of die micro-assembly solutions

These services are on 6” wafers (max), typically provided by the customer.

Customer benefits are:

  • Independent and fast electrical monitoring of EPI quality
  • Electrical SPC for in-house processes
  • High-quality, IP-safe source for customized active devices
  • Flexibility to optimize processes to meet customer-specific device performance requirement

Check out our other MEMS applications

MEMS applications are many. Organ-on-a-chip for example, where a human organ is reproduced in its most elementary form: microelectromechanical systems device. Several applications stand out, because of their promise and our capabilities.

Relevant for you: MEMS & Micro Devices MEMS is our expertise

Sustainable competitive advantage through custom MEMS devices. Check out our services in the MEMS & Micro Devices key area of expertise.

News & events

Projects on ultrasound innovation awarded for future generation microfabrication technologies for ultrasound products and imaging catheters.

Presentation by technologist René Sanders about microfluidic device standardization and manufacturability at the Polymer Replication on Nanoscale conf.

Increasingly complex ultra-high frequency IC chips demand state-of-the-art RF characterization, and Philips Engineering Solutions offers on wafer device characterization with powerful functionality.

Contact us about GaN-on-Si

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