We offer the following services:

  • Capability to process GaN-on-Si (dry etch, metallization) on 150 mm
  • Development and manufacturing of process flows for devices
  • Rapid electrical wafer characterization
  • Process development, manufacturing and characterization of test structures, and passive and active devices for high-voltage and RF-power applications
  • Wafer re-shaping, including re-beveling
  • Development of die micro-assembly solutions

These services are on 6” wafers (max), typically provided by the customer.

Customer benefits are:

  • Independent and fast electrical monitoring of EPI quality
  • Electrical SPC for in-house processes
  • High-quality, IP-safe source for customized active devices
  • Flexibility to optimize processes to meet customer-specific device performance requirement

Check out our other MEMS applications

MEMS applications are many. Organ-on-a-chip for example, where a human organ is reproduced in its most elementary form: microelectromechanical systems device. Several applications stand out, because of their promise and our capabilities.

Relevant for you: MEMS & Micro Devices MEMS is our expertise

Sustainable competitive advantage through custom MEMS devices. Check out our services in the MEMS & Micro Devices key area of expertise.

Contact us about GaN-on-Si

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